Hengqin, Macao co-host “China Chip” Integrated Circuit Industry Innovation Conference

Source: hengqin.gov.cn Date: 2026-11-11

The 2026 “China Chip” Integrated Circuit Industry Innovation Conference & 21st “China Chip” Awards Ceremony were held from November 1st to 4th in both the Guangdong-Macao In-Depth Cooperation Zone in Hengqin and the Macao Special Administrative Region. Hengqin has supported the “China Chip” Conference for the sixth consecutive year. It marks the first time that the event has been held at two main venues, with an international venue in Macao.

P 1111-1.jpg

The Conference received 364 products submitted by 273 companies, with products from six Hengqin companies on the “China Chip” excellent product list.

P1111-2.jpg

More companies are setting up in Hengqin, a sign that the Hengqin-Macao ecosystem for tech R&D and high-end manufacturing is taking shape rapidly. Hengqin is now home to over 100 integrated circuit companies spanning core segments of the industry, fostering a more diverse and complete industrial chain.

Hengqin connects Macao’s resources with the Chinese mainland, transferring theoretical research into practical use. In recent years, with support from Hengqin, Macao’s universities have established more than 30 joint university-enterprise laboratories in the Cooperation Zone and carried out over 600 R&D and innovation projects.

Download: